詳細

日本語版　フィールドガイド　オプティカルリソグラフィー

The material in this Field Guide is a distillation of material put together by Chris Mack over the past 20 years, including notes from his graduate-level lithography course at the University of Texas at Austin. This Field Guide details the lithography process, image formation, imaging onto a photoresist, photoresist chemistry, and lithography control and optimization. An introduction to next-generation lithographic technologies is also included, as well as an extensive lithography glossary and a summation of salient equations critical to anyone involved in the lithography industry. 　

Sample Pages(PDF)

Symbol Glossary
The Lithography Process
　　Definition: Semiconductor Lithography
　　Overview of the Lithography Process
　　Processing: Substrate Preparation
　　Processing: Photoresist Spin Coating
　　Processing: Post-Apply Bake
　　Processing: Alignment and Exposure
　　Processing: Post-Exposure Bake
　　Processing: Development
　　Processing: Pattern Transfer
Image Formation
　　Maxwell?s Equations: The Mathematics of Light
　　The Plane Wave and the Phasor
　　Basic Imaging Theory
　　Diffraction
　　Fraunhoffer Diffraction: Examples
　　The Numerical Aperture
　　Fourier Optics
　　Spatial Coherence and Oblique Illumination
　　Partial Coherence
　　Aberrations
　　Aberrations: The Zernike Polynomial
　　Aberrations: Zernike Examples
　　Chromatic Aberration
　　Horizontal-Vertical (H-V) Bias
　　Defocus
　　Flare
　　Vector Nature of Light
　　Polarization
　　The Optical Invariant
　　Immersion Lithography: Resolution
　　Immersion Lithography: Depth of Focus
Imaging into a Photoresist
　　Standing Waves: Definition
　　Standing Waves: Mathematics
　　Fresnel Reflectivity
　　Swing Curves
　　Top Antireflective Coatings (TARC)
　　Bottom Antireflective Coatings (BARC)
Photoresist Chemistry
　　Novolak/DNQ Resists 39
　　Chemically Amplified Resists 40
　　Absorption of Light
　　Photoresist Bleaching and the Dill Parameters /42
　　Exposure Kinetics
　　Measuring the Dill ABC Parameters
　　Chemically Amplified Resist Kinetics
　　Diffusion in Chemically Amplified Resists
　　Acid Loss Mechanisms
　　Post-Apply Bake Effects
　　Photoresist Development Kinetics
　　Surface Inhibition
　　Developer Temperature and Concentration
　　The Development Path
Lithography Control and Optimization
　　NILS: The Normalized Image Log-Slope
　　NILS: The Log-slope Defocus Curve
　　NILS: Image Optimization
　　NILS: Exposure Optimization
　　NILS: PEB Optimization
　　NILS: Development Optimization
　　NILS: Total Process Optimization
　　Defining Photoresist Linewidth
　　Critical Dimension Control
　　Critical Dimension Control: Effect on Devices
　　Overlay Control
　　Line Edge Roughness
　　Metrology: Critical Dimension
　　Metrology: Overlay
　　The Process Window
　　Depth of Focus
　　Resolution
　　Rayleigh Criteria: Resolution
　　Rayleigh Criteria: Depth of Focus
　　Mask Error Enhancement Factor (MEEF)
　　Resolution Enhancement Technologies
　　Phase Shift Masks
　　Phase Shift Masks: Alternating
　　Phase Shift Masks: Attenuated
　　Optical Proximity Effects
　　Optical Proximity Correction (OPC)
　　Off-Axis Illumination
　　Lithography Simulation
　　Moore?s Law
　　Next Generation Lithography (NGL)
Equation Summary
Glossary
Index